It is practical to test the through-silicon via (TSV) connections between the stacked memory and logic die using built-in self-test (BIST) techniques that are used to test embedded memories within ...

Two P1687 SIBs could be deployed back to back and function as an embedded and self-contained two-bit access instruction register, opening and closing the scan paths to provide the four functions ...

If you already have a 3D printer or two, you likely don't need the Bambu Lab A1 Combo unless you're looking to break into color printing. If you're already using a different style of machine, like a ...

Imec has worked with Cadence Design Systems to validate an automated 3D design-for-test tool for logic-memory interconnects in DRAM-on-logic stacks. The tool, which is based on Cadence Encounter test ...

Moore’s Law scaling is slowing down and limited improvements in performance, power, area, and cost are available from one process node to the next. As a result, advanced packaging and 3D stacking ...