Ball grid array (BGA) reworking typically involves de-soldering and resoldering the chip to remove defective components and mount new ones. However, it’s a complex task, and people can easily make ...
(MENAFN- EIN Presswire) EINPresswire/ -- In the fast-paced electronics industry, the ability to produce compact, high-performance devices depends heavily on advanced PCB assembly techniques. FR4PCB, a ...
BGA soldering is very reliable if done using the correct procedure, so we introduce GA Soldering on PCB board, BGA Inspection and BGA Rework. According to different packaging materials, BGA components ...
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