Let the era of 3D V-Cache in HPC begin. Inspired by the idea of AMD’s “Milan-X” Epyc 7003 processors with their 3D V-Cache stacked L3 cache memory and then propelled by actual benchmark tests pitting ...

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A multichip package (MCP) solution based around a PowerPC 755E RISC processor provides a compact, high-performance memory solution for space-sensitive, low-power systems. The WED3C755E8M-XBHX combines ...

so i got in this pissing match with my cs instructor. he was telling the class that there are four transistors per bit of L2 cache on any given cpu with on-die, full-speed cache (not actually the ...

The microprocessor-memory gap has been growing for over 30 years, and in that time caches have been crucial components in digital system design. All high-performance microprocessors are designed with ...

The Cache MX IP compresses on-chip L2, L3 SRAM cache enabling 2x effective capacity. SRAM Caches can take upto 30-50% of an SoC xPU silicon real estat ...

At the International Solid State Circuits Conference, IBM will present details on its new Embedded DRAM, or eDRAM. Designed for on-die use with CPUs, eDRAM is nearly as fast as the SRAM currently used ...