Flip chip microelectronic packaging has emerged as a cornerstone technology in modern semiconductor assembly, wherein the die is mounted upside down to the substrate to facilitate direct ...

ASMPT will be exhibiting at SEMICON Taiwan from September 10 to 12, 2025. The theme of the presentation at Booth L0716 at Level 4, TaiNEX 1 in Taipei is: "Empower the Intelligence Revolution." This ...

Apple is reportedly in exploratory conversations with at least one partner to potentially handle iPhone chip assembly and packaging in India for the first time. Here are the details. According to The ...

The Union Cabinet approved a new semiconductor plant in Uttar Pradesh's Jewar to be jointly set up by HCL Group and Foxconn. The newly approved facility will come up at an investment of Rs 3,700 crore ...