Experienced designers of 10 Gbits/sec (10G) Ethernet, SONET/OTN, Infiniband (QDR/FDR), and Fibre channel (16/8GFC) products are well aware that the maintenance of signal quality is far more difficult ...

To achieve gains in power, performance, area, and cost, 3D-IC architectures are pushing electronics design to new limits. Silicon integration technology and associated devices have undergone an ...

Leading-edge chip desiLeading-edge chip design was never easy, but it’s getting harder all the time. Rapid advances in communication systems are driving data rates higher. With the emergence of ...

Signal integrity is a critical design consideration in modern electronic systems, particularly those that depend on high-speed interconnects. As data rates climb and interconnect geometries become ...

The potential causes of signal integrity problems in a device are wide ranging, including the physical layout of the design, underperforming components, and accumulative affects with multiple causes.

Automotive ethernet is increasingly utilized for in-vehicle electronics to transmit high speed serial data between interconnected devices and components. Due to the relatively fast data rates, and the ...

Connectivity is becoming a bottleneck in the age of AI. To unclog the interconnects between processors, accelerators, and memory, high-speed serial interfaces based on the PCIe Gen 6 bus are in the ...

Signal and power integrity have become pivotal concerns as data center and aerospace and defense products grow more complex and operate at higher frequencies. For Benjamin Dannan, the foundation of ...