Empower RF Systems' latest C-UAS RF amplifier module is engineered for robust performance in demanding military and defense ...

Could Be Built by the Assembly of Different Silicon Technologies at Wafer Level, Allowing the Dense Co-integration of Best-In Class Functions.

Latest releases of OpenTX Update the OpenTX firmware elrs lua Script ExpressLRS project ExpressLRS configurator 2.4 Ghz rf ...

IndieSemiC and C-DAC Trivendrum signed an MoU to collaborate on semiconductor and embedded system development. Joint development of an AI chip based on C-DAC Trivendrum’s 64-bit VEGA processor with on ...

CEA-Leti and STMicroelectronics have outlined a method that could push RF modules towards full monolithic integration on ...

Industry: Partnership also aims to support the creation of an indigenous hardware and software ecosystem through the use of C ...

Renesas has introduced the RA6W1 dual-band Wi-Fi 6 wireless MCU along with the RA6W2 MCU that integrates both Wi-Fi 6 and ...

The RA6W1 MCU supports dual-band Wi-Fi 6, while the RA6W2 combines Wi-Fi 6 with Bluetooth Low Energy (LE) connectivity. The ...

Cornell engineers have built a next-gen transistor on bulk aluminum nitride that runs cooler, handles higher power, and ...

G will push antenna technology to new limits, demanding intelligent, adaptive, and multi-band systems capable of supporting ...

USI's MCC has developed a new packaging approach that integrates Vacuum Printing Encapsulation (VPE) with high–aspect ratio copper pillar mass-transfer technology, the company said. After three years ...

Kyocera and Rohde & Schwarz will showcase the characterisation of Kyocera’s novel phased array antenna module at CES 2026 in Las Vegas, NV.